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Semiconductor
Extreme temperature forcing range from liquid-free phase change technology enables quiet, portable thermal control in your test environment or into production automated test equipment in the industry’s smallest footprint.
Accelerate time to market and improve trusted reliability with high performance liquid cooling systems that speed up test cycle times and maintain pure test environments.
Maximize thermal density with innovative liquid, air and two-phase cooling technologies. Compact direct to chip cooling customized to maximize performance in each application. Cool up to 2200W now, continued research and development to push power density and compute performance boundaries to the next level.
Improve semiconductor reliability and in line test efficiency using highly reliable burn-in and test sockets that employ innovative contact technologies. Platform sockets to full custom designs are available to meet your technical requirements and maximize board density.
Liquid-free thermal systems leverage innovative phase change technologies to provide a temperature forcing range from -55°C to 250°C for semiconductor testing in multiple stages throughout the manufacturing cycle. Phase change technologies enable quieter, portable test solutions with fast stabilization, superior power handling and precision control. Easy-to-integrate thermal forcing systems in the industry’s smallest footprint can be used in your test environment or into production automated test equipment. Thermal forcing systems accommodate a wide range of device sizes and types, whether socketed or soldered down. Applications include DUT level thermal management, thermal stream replacement, temperature forcing, handler integrations, ATE test, bench testing, system level testing, high reliability testing and OEM integrations.
Logic and memory burn-in and test sockets feature innovative contact technology that gives more reliable electrical and mechanical interconnect. Contact design is optimized to minimize damage to the solder ball with lowest possible actuation force. Contacts open to allow package insertion for 0.5mm pitch and above. Several contact technologies, both through- hole and compression mount, are used for finer pitch packages < 0.5mm. Platform design gives ultimate flexibility in base sockets than can be used for different package sizes leveraging an adapter customized for specific customers’ packages. Changing an adapter to the socket is faster and lower cost than providing new sockets for each package size. Modifying base designs allows us to help customers choose the smallest socket footprint to maximize burn-in board capacity and through-put.
Comprehensive direct to chip cooling solutions range from air cooling to high efficiency liquid cooling and innovative immersion cooling development that maximize thermal density and enable higher processing power in the most compact format. Cool switch chips up to 2200 watts (W), GPUs up to 750W and IGBTs up to 6KW now with continued research and development from Eaton to push power density and compute performance boundaries to the next level.
Leveraging high performance fans and blowers with remote heat pipe-heat sink assemblies, air cooling can easily be routed to cool entire blades and racks in cloud applications while maximizing server density and using existing facility plumbing for efficient performance upgrades in current infrastructure. Liquid loops and liquid cold plates cooled by coolant distribution units (CDUs) or other liquid cooling systems provide highest performance direct to chip liquid cooling for advanced GPUs, CPUs, and switch chips. Custom skyline liquid cold plates create the most efficient thermal interface between liquid systems and the processors, customized to maximize thermal efficiency for each system installation. This maximizes full system performance and environmental sustainability while enabling higher processing density and longer semiconductor lifetimes for marketable performance differentiation.
Semiconductor automated test equipment (ATE) operates at high speed and power, requiring advanced liquid cooling systems. Eaton’s innovative liquid cooling systems optimize each step in testing a semiconductor for ultimate quality control with maximum test cycle efficiency for trusted reliability and fastest speed to market. Liquid cold plates driven by efficient liquid cooling systems and chillers thermal insulation keep fluid lines cold so wafers and chips are tested at safe temperatures in pure environments. Optimized thermal management protects sensitive components from excessive heat loads while decreasing thermal cycle test times.
Eaton’s highly efficient, reliable and sustainable liquid cooling systems decrease test times, maximize temperature forcing range or decrease chip operation temperature for faster processing and better uptimes.
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