Rise of power: increasing power demand for high-performance chips

The semiconductor industry continues to drive Moore’s Law and push the boundaries of semiconductor chip power and performance. Higher performance, more powerful and complex chips generate more heat with higher power densities. Thermal technology innovators like Eaton are developing new methods to cool exponentially rising chip power and performance.

Innovate with Eaton: efficiently cool next generation semiconductors

Eaton’s strong heritage of two-phase cooling like 3D vapor chambers and thermosiphons and liquid cooling system technologies such as coolant distribution units, liquid cold plates and chillers enables us to explore new possibilities and develop advanced cooling solutions to effectively and efficiently cool chips further than 1600 watts. These chips are crucial for growing applications like Artificial Intelligence and autonomous computing in the cloud and eMobility industries.

Eaton’s development team is looking beyond the next few years of semiconductor development, so if your chip requirements exceed what you think is currently possible, please contact us. We may already be working on a solution.